The 50th Ship & Offshore Design Research Colloquium was held under the auspices of the Korean Register of Shipping at the Gaya Campus, Dong-eui University, on February 21 (Thu.) and 22 (Fri.), 2019. First launched in 1994, the biannual colloquium was convening for the 50th time this year, and it was attended by guests such as the President Dae-Seung Cho of SNAK, the General Affairs Director Hyun Soo Kim of SNAK, Director Tae-Bum Ha of the Korean Register of Shipping, and Dean Byoung-chul Shin of the College of Engineering, Dong-eui University. Including the Committee Chairperson Sung-kwang Shin, there were over 150 participating members from relevant industries, universities, and research institutes and a total of 52 papers were presented. In addition, the three major Korean shipbuilders (Hyundai Heavy Industries, Daewoo Shipbuilding & Marine Engineering, and Samsung Heavy Industries) introduced their future strategies and latest smart technologies in a special session on the theme “Future Shipbuilding and Marine Technologies of Korea.” drawing much interest from the participants. At the general meeting held on February 21, a video documenting the history and progress of the research committee was shown in commemoration of the 50th anniversary of the colloquium. Further, plaques of appreciation were given to committee advisors such as the Professor Emeritus Young-joong Kwon of the University of Ulsan (the 1st Vice-Chairperson), Professor Hyo Kwan Leem of Pusan National University (the 9th Chairperson), Vice-President Tae-ik Cho of GAS Entec (the 10th Chairperson), and Professor Hagsu Jang of Pusan National University (the 12th Chairperson), for their contributions to the development of the research committee. In his opening address, the Committee Chairperson Sung-kwang Shin urged members to “make every effort to improve our technologies and productivity so that Korea’s shipbuilding and marine industry can become a true leader in the global industry without being swayed by the external environment, and lead the way in securing the technological capability to cope with the changing environment and new market conditions.”